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SAE AMS 3695/3:2014-08-15 Adhesive Film, Epoxy-Base, High Durability For 175 °C (350 °F) Service
SAE AMS 3695/4:2014-08-15 Adhesive Film, Epoxy-Base, High Durability For 215 °C (420 °F) Service
SAE AMS 3689B:2014-08-14 Adhesive, Foaming, Honeycomb, Core Splice, Structural -54 to +177 °C (-65 to +350 °F)
SAE AMS 3692C:2014-08-14 Adhesive Compound, Epoxy Resing High Temperature Application
SAE AMS 3695/1:2014-08-14 Adhesive Film, Epoxy-Base, High Durability For 95 °C (200 °F) Service
SAE AMS 3695/2:2014-08-14 Adhesive Film, Epoxy-Base, High Durability For 120 °C (250 °F) Service
SAE ARP 1610A:2014-08-14 Physical-Chemical Characterization Techniques, Epoxy Adhesive and Prepreg Resin Systems
SAE AMS 3695:2014-08-14 Adhesive Film, Epoxy-Base For High Durability Structural Adhesive Bonding
SAE AMS 3688B:2014-08-14 Adhesive, Foaming, Honeycomb Core Splice, Structural -55 °C to +82 °C (-65 °F to +180 °F)
SAE ARP 1612A:2014-08-14 Polyimide Printed Circuit Boards Fabrication of
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