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SAE ARP 1612A:2014-08-14

SAE ARP 1612A:2014-08-14

SAE ARP 1612A:2014-08-14

Polyimide Printed Circuit Boards Fabrication of

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This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.

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