1.1 ,This specification covers low-melting point metal alloys and solders, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cadmium, bismuth-tin-lead-indium-cadmium, bismuth-tin-lead-indium, indium-lead, and indium-lead-silver, and indium-tin joining together two or more metals at temperatures below their melting points, blocking for support and removable borders, radiation shielding, fusible plugs, fuses, tube bending, and punch setting.