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ASTM F459-13(2018)

ASTM F459-13(2018)

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

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1.1 ,These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μ,m).

Note 1: ,Common usage at the present time considers the term “,wire bond”, to include the entire interconnection: both welds and the intervening wire span.

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