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Home>ASTM F3192-16

ASTM F3192-16

ASTM F3192-16

Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization

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1.1 ,This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.

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