Volume 10.04 covers standards on electronics, including:

• Innerlayer interconnections and bonding

• Materials and processes for vacuum tubes

• Electronic device characterization

• Hermetic seals

• Hybrid circuits and substrates

• Microelectronic packaging

• Leak testing

• And more



This volume also includes the latest standards relating to:

• Declarable substances in materials

• 3D imaging systems

• Additive manufacturing technologies