IEC 61189-2-801 Ed. 1.0 b:2023

IEC 61189-2-801 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
standard by International Electrotechnical Commission , 07/01/2023

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This part of IEC 61189 defines a test method to be followed for thermal performance via carbon
ink heating. The method employs a screened-on pattern of carbon ink used to determine the
thermal performance of a dielectric layer on a metal base plate.

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Edition: 1.0 Published: 07/01/2023 ISBN(s): 9782832272589 Number of Pages: 26 File Size: 1 file , 1.3 MB Note: This product is unavailable in Ukraine, Russia, Belarus

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IEC 61189-2-801 Ed. 1.0 b:2023

IEC 61189-2-801 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
standard by International Electrotechnical Commission , 07/01/2023

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IEC 61189-2-801 Ed. 1.0 b:2023

IEC 61189-2-801 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials standard by International Electrotechnical Commission , 07/01/2023

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IEC 61189-2-801 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
standard by International Electrotechnical Commission , 07/01/2023