Cart

No products

Shipping $0.00
Total $0.00

Cart Check out

Home>IEC 61189-2-804 Ed. 1.0 b:2023

IEC 61189-2-804 Ed. 1.0 b:2023

IEC 61189-2-804 Ed. 1.0 b:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

standard by International Electrotechnical Commission , 08/01/2023

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$10.00

$25.00

(price reduced by 60 %)

Full Description

This part of IEC 61189 specifies a test method to determine the time to delamination of base
materials and printed boards using a thermomechanical analyser (TMA). Temperatures used
for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

Product Details

Edition: 1.0 Published: 08/01/2023 ISBN(s): 9782832274224 Number of Pages: 20 File Size: 1 file , 700 KB Note: This product is unavailable in Ukraine, Russia, Belarus

Contact us