Cart

No products

Shipping $0.00
Total $0.00

Cart Check out

IEC 63251 Ed. 1.0 b:2023

IEC 63251 Ed. 1.0 b:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

standard by International Electrotechnical Commission , 11/01/2023

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$76.00

$190.00

(price reduced by 60 %)

Full Description

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Contact us