Cart

No products

Shipping $0.00
Total $0.00

Cart Check out

IEC 60191-6-17:2011

IEC 60191-6-17:2011

IEC 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$71.20

$178.00

(price reduced by 60 %)

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Contact us