Cart

No products

Shipping $0.00
Total $0.00

Cart Check out

Viewed products

  • IEC...

    IEC 62047-19:20- 13 IEC 62047-19:20- 13 ...>>

  • IEC...

    IEC 61754-4:2013 IEC 61754-4:2013 ...>>

IEC 62047-18:2013

IEC 62047-18:2013

IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$28.40

$71.00

(price reduced by 60 %)

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Contact us