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Home>IEC TR 62866:2014

IEC TR 62866:2014

IEC TR 62866:2014

IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

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IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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