IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8,
b) a definition of the term "stand-off" has been added,
c) the methods for locating the datum have been extended to be suitable for SMD-packages,
d) the visual identification of terminal position one for automatic handling has been clarified,
e) the rules for the drawing of terminals have been clarified,
f) Table A.1 has been completed with symbols specifically for SMD-packages,
g) Annex B "Standardization philosophy" has been deleted,
h) a normative Annex with special rules for SMD-packages has been added,
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.